MU Digital Repository
Logo

Repurposing the Tin-Lead Solder Scrap Generated in an Educational Institute

Bhat, Ritesh R and kumar, Atul and Moni, Pushkar and Kumar, Sourabh (2015) Repurposing the Tin-Lead Solder Scrap Generated in an Educational Institute. In: 4th World Conference on Applied Sciences, Engineering & Technology, 24-26 October 2015, Kumamoto University, Japan.

[img] PDF
119.pdf - Published Version
Restricted to Registered users only

Download (471kB) | Request a copy

Abstract

The pace with which the world is developing today is directly proportional to the pace of declining environmental sustainability. Electronic equipment has signified their need in the modern era, with the world’s population growing rapidly and generally improving wealth. It is a known fact that every electronic component has got a life, after which it is considered to be scrap. Out of the several problems awaiting to be addressed, disposal of electronic wastes generally known as Waste Electrical and Electronic Equipment (WEEE) is a major one to be concentrated. Generally, when the WEEE is spoken of, one only thinks about industries producing the electronic goods and no-one thinks about the educational institutes as their generator. The paper concentrates mainly on the repurposing of tin-lead solder scrap, a WEEE, found abundantly in laboratories of the selected educational institute. The work resulted in obtaining 92% of reusable tin-lead solder material from the scrap collected from the laboratories of the institute

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Electronic Wastes; Environmental Sustainability; Lead Solder Scrap
Subjects: Engineering > MIT Manipal > Mechanical and Manufacturing
Depositing User: MIT Library
Date Deposited: 10 Feb 2016 11:04
Last Modified: 10 Feb 2016 11:04
URI: http://eprints.manipal.edu/id/eprint/145216

Actions (login required)

View Item View Item