Soldering of copper using graphene-phosphoric acid gel

Puranik, Gurudatt and Sarkar, Asis and Mishra, Nirankar and Gurumurthy, S C and Shridhar, M (2021) Soldering of copper using graphene-phosphoric acid gel. Journal of Metals, Materials and Minerals, 30 (4). pp. 60-67. ISSN 0857-6149

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Abstract

Soldering is a physical process in which one metal melts and joins the other to form a strong bond, which further helps in electron conduction and increases the mechanical strength in any electronic circuits. The present work demonstrates the development of graphene-based flux comprising of 2 g of graphene and 2 ml of phosphoric acid for the residue-free, high stability, durable, and two-step soldering of copper wire on to the surface of the copper-based printed circuit board. The soldering flux can be applied to the copper, and wire can be soldered in ambient conditions using commercial soldering iron at a standard soldering temperature of 260℃. This flux helps the formation of strong and electrically conducting joints between the copper wire and copper-based printed circuit board. The joints are studied with scanning electron microscope images, and energy dispersive X-ray mapping successfully shows the formation of a joint between the copper wire and the copper and also shows the presence of graphene between the joint.

Item Type: Article
Uncontrolled Keywords: Soldering flux; Carbon nanomaterials; Graphen
Subjects: Engineering > MIT Manipal > Physics
Depositing User: MIT Library
Date Deposited: 11 Nov 2021 09:57
Last Modified: 11 Nov 2021 09:57
URI: http://eprints.manipal.edu/id/eprint/157440

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