Highly thermal conductive epoxy nanocomposites filled with 3D BN/C spatial network prepared by salt template assisted method

Pan, Duo and Li, Qianming and Zhang, Wei and Dong, Jingwen and Su, Fengmei and Murugadoss, Vignesh and Liu, Yongzhi and Liu, Chuntai and Naik, Nithesh and Guo, Zhanhu (2021) Highly thermal conductive epoxy nanocomposites filled with 3D BN/C spatial network prepared by salt template assisted method. Composites Part B, 209. ISSN 1359-8368

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Abstract

The construction of heat conduction paths in the polymer matrix is essential to improve the thermal management performance of polymer composites. A three-dimensional (3D) thermally conductive network with regular filler structures is very attractive for building fast conductive paths in polymer composites. Herein, a unique 3D interconnected tannic acid modified boron nitride (BN) and C network (M-BN/C) was successfully fabricated by the carbonization of M-BN/thermoplastic polyurethane (TPU) skeletons, which were obtained via simple salt template assisted strategy to enhance the thermal transfer properties of composites. The highly thermally conductive epoxy composites (M-BN/C/EP) were then prepared by impregnating epoxy resin (EP) into the 3D MBN/ C network. The thermal conductivity of the composites with a M

Item Type: Article
Uncontrolled Keywords: Boron nitride Salt template method Thermal conductivity Thermal conduction network Epoxy composites
Subjects: Engineering > MIT Manipal > Mechanical and Manufacturing
Depositing User: MIT Library
Date Deposited: 29 Oct 2021 05:09
Last Modified: 29 Oct 2021 05:09
URI: http://eprints.manipal.edu/id/eprint/157522

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