Mechanical, Thermal and Electromagnetic Shielding Efectiveness of MWCN‑ABS Films

Chandra, Jagadeesh R. B and Shivamurthy, B and Kumar, Sathish M and Thimmappa, B H S (2022) Mechanical, Thermal and Electromagnetic Shielding Efectiveness of MWCN‑ABS Films. Transactions on Electrical and Electronic Materials. ISSN 1229-7607

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Abstract

The multi-walled carbon nanotubes (MWCNTs) and the poly(acrylonitrile-co-butadiene-co-styrene) (ABS) granulates are dispersed in acetone separately using a magnetic stirrer followed by ultrasonication. Further, both the solutions were mixed with magnetic stirring followed by ultrasonication. Neat-ABS flm, 0.25 wt%, 0.5 wt% and 1 wt% of MWCNT-ABS nano�composite flms of the average thickness of 140 µm are fabricated by the solution molding using a petri dish, followed by room temperature curing and further hot compression to maintain uniform thickness. The tensile properties, thermal stability, electrical conductivity, and EMSE of all flms are investigated. The results indicate that the addition of MWCNTs to ABS enhanced the mechanical properties and electrical conductivity, thermal stability, and EMSE. The 0.25 wt% MWCNT-ABS nanocomposite flms show attractive mechanical, electrical, thermal, and EMSE as compared to neat-ABS flms. More than 0.25 wt% MWCNTs in the ABS matrix deteriorates the tensile strength. However, 0.5 wt% MWCNT-ABS nanocomposites exhibit better tensile strength, Young’s modulus, electrical conductivity, and EMSE than neat-ABS. In this research, we used a low quantity of MWCNTs and followed a one-time heating process in the entire fabrication, and produced MWCNT-ABS nanocomposite flms with reasonable properties. Hence, this may be one of the options to produce nanocomposites suitable for EMS materials. We recommend that these flms may be used as interlayers to develop an X-band range electromagnetic wave shielding material.

Item Type: Article
Uncontrolled Keywords: Electromagnetic shielding efectiveness (EMSE) · Electrical conductivity · MWCNT · High aspect ratio
Subjects: Engineering > MIT Manipal > Chemistry
Engineering > MIT Manipal > Electronics and Communication
Engineering > MIT Manipal > Mechanical and Manufacturing
Depositing User: MIT Library
Date Deposited: 23 Jun 2022 04:22
Last Modified: 23 Jun 2022 04:22
URI: http://eprints.manipal.edu/id/eprint/158800

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