Electrical Conductivity and Mechanical Properties of Dendritic Copper Particulate Polymer Films

Shivamurthy, B and Thimmappa, B H S and Purushothama, Rohan and Sai, Datta G. K. V. D. (2018) Electrical Conductivity and Mechanical Properties of Dendritic Copper Particulate Polymer Films. Transactions on Electrical and Electronic Materials, 19 (2). pp. 1-7. ISSN 1229-7607

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Abstract

Hybrid filler loaded multi-layer polymer composites are becoming one of the suitable alternative material for electromagnetic interference shielding (EMIS) applications. Mainly these composites are manufactured by conductive/magnetic fabrics, foams, foils or films or a combination of all, layered in an orderly architecture to obtain effective EMIS. In this work, dendrite structured copper particulate dispersed in cellulose acetate polymer (CA). We have developed approximately 100-micron thickness of cellulose acetate/copper filler (CA/Cu) films (7–55 wt%) and a neat CA film. The electrical conductivity, tensile strength, percentage of elongation, burst strength and folding endurance of CA/Cu films were measured and compared. The percolation threshold for conductivity was found at 28 wt% and the drastic increase in conductivity at 28–37 wt%. The mechanical strength of CA/Cu composite films was investigated and reported.

Item Type: Article
Uncontrolled Keywords: Mechanical properties · Electrical conductivity · Particulate polymer films
Subjects: Engineering > MIT Manipal > Chemistry
Engineering > MIT Manipal > Mechanical and Manufacturing
Depositing User: MIT Library
Date Deposited: 17 Dec 2018 10:23
Last Modified: 17 Dec 2018 10:23
URI: http://eprints.manipal.edu/id/eprint/152382

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