Items where Author is "Beck, Peter"
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Conference or Workshop Item

Bhat, Subraya Krishna and Deshpande, Raghavendra and Beck, Peter and Hegde, Sudarshan (2016) Study on Effect of Thermo-Structural loading on the PCB during Selective Soldering process using Finite Element Method. In: International Conference on Electronics Packaging, 20/04/2016, Sapporo Education and Culture Hall, Hokkaido,Japan.

This list was generated on Fri Jan 21 17:00:23 2022 UTC.